BeCe™ Contact Braided Probe Pins
The precision art of braiding, the perfect connection for testing. In the nanoscale semiconductor world, the quality of testing determines the speed of innovation. BeCe™ Contact Braided Probe Pins, with revolutionary braiding technology, provide unparalleled testing accuracy and reliability for your cutting-edge chip designs.
Breakthrough Braiding Technology
The unique braiding technology of BeCe™ creates Contact Buttons that achieve multiple breakthroughs in the testing field:
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Ultra-thin Design: Adapts to the strict spatial constraints of advanced packaging
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Outstanding High-Frequency Performance: Lossless testing of high-speed signals from 5G/6G to 112G+PAM4
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Extremely Low Inductance Characteristics: Minimizes parasitic effects, ensuring the integrity of test signals
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High Bandwidth Capability: Perfectly supports the testing needs of next-generation high-speed designs
The Micro-Wipe technology of BeCe™ Contact Buttons brings a revolutionary testing experience:
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Perfect Penetration of Oxide Layers: Ensures electrical integrity with every test
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Non-Damaging Contact: Protects your valuable design samples
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Consistent Contact Impedance: Provides reliable testing data
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Multiple Use Lifespan: Significantly reduces overall testing costs
Designed for the next generation of chip designs, as chip design moves towards higher frequencies, lower power consumption, and more complex mixed-signal designs, BeCe™ Contact Buttons offer a key competitive advantage:
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Perfectly Supports Digital and Analog Mixed-Signal Testing
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Outstanding High-Speed Signal Integrity Performance
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Adapts to Full-Process Testing Needs from Laboratory to Mass Production
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Next-Generation Products Fully Meet Wafer-Level Testing Requirements